Contacts
Address
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Director
Cherry
Phones of enterprise
management
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Internet
Site:
In stock
Price:
1 CNY
Applicable PCB (L x W): 50 × 50 to 700 × 460mm
Minimum component: 0201
Minimum QFP pitch: 0.4mm
Minimum IC pitch: 0.30mm.
Minimum BGA ball diameter: 0.40mm
Ball pitch: 1.0mm
Maximum BGA size: 74x74mm
Group: Standard logic microcircuit chips
In stock
Price:
1 CNY
Applicable PCB (L x W): 50 × 50 to 700 × 460mm
Minimum component: 0201
Minimum QFP pitch: 0.4mm
Minimum IC pitch: 0.30mm
Minimum BGA ball diameter: 0.40mm
Ball pitch: 1.0mm
Maximum BGA size: 74x74mm
Group: Integrated chip, microassembly
In stock
Price:
1 CNY
Specifications:Applicable PCB (L x W): 50 × 50 to 700 × 460mmMinimum component: 0201Minimum QFP pitch: 0.4mmMinimum IC pitch: 0.30mmMinimum BGA ball diameter: 0.40mmBall pitch: 1.0mmMaximum BGA size: 74x74mm
Service include: PCB layout and BOM design or copying, component procurement,...
Group: Electronic payments
In stock
Price:
0.1 CNY
Base material: PTFE, PCB, FR4
Layer count: 4layer board
Board thickness: 0.8mm
Copper thickness: 1oz
Surface finishing: ENIG
Soldermask color: green
Group: Circuit boards
In stock
Price:
1 CNY
Specifications:Applicable PCB (L x W): 50 × 50 to 700 × 460mmMinimum component: 0201Minimum QFP pitch: 0.4mmMinimum IC pitch: 0.30mmMinimum BGA ball diameter: 0.40mmBall pitch: 1.0mmMaximum BGA size: 74x74mm
Service include: PCB layout and BOM design or copying, component procurement,...
Group: HF boards
In stock
Price:
0.1 CNY
Layers: 4
Base material: FR4
Copper thickness: 1oz
Board thickness: 1.0mm
Min. hole size: 0.45mm
Min. line width: 3 mils
Min. line spacing: 3 mils
Surface finishing: gold immersion
Group: Substrates for microelectronics
In stock
Price:
1 CNY
Specifications:Applicable PCB (L x W): 50 × 50 to 700 × 460mmMinimum component: 0201Minimum QFP pitch: 0.4mmMinimum IC pitch: 0.30mmMinimum BGA ball diameter: 0.40mmBall pitch: 1.0mmMaximum BGA size: 74x74mm
Service include: PCB layout and BOM design or copying, component procurement,...
Group: Electronic payments
In stock
Price:
0.1 CNY
Specifications:
Layers: 4
Base material: FR4
Copper thickness: 1oz
Board thickness: 1.0mm
Min. hole size: 0.45mm
Min. line width: 3 mils
Min. line spacing: 3 mils
Surface finishing: gold immersion
Group: Circuit boards
In stock
Price:
1 CNY
Specifications:Applicable PCB (L x W): 50 × 50 to 700 × 460mmMinimum component: 0201Minimum QFP pitch: 0.4mmMinimum IC pitch: 0.30mmMinimum BGA ball diameter: 0.40mmBall pitch: 1.0mmMaximum BGA size: 74x74mm
Service include: PCB layout and BOM design or copying, component procurement,...
Group: Electronic payments
In stock
Price:
1 CNY
Specifications:Applicable PCB (L x W): 50 × 50 to 700 × 460mmMinimum component: 0201Minimum QFP pitch: 0.4mmMinimum IC pitch: 0.30mmMinimum BGA ball diameter: 0.40mmBall pitch: 1.0mmMaximum BGA size: 74x74mm
Service include: PCB layout and BOM design or copying, component procurement,...
Group: Circuit boards
